March 3, 2020
SECO’s desire to be at the forefront with the newest technologies has led the company to always deliver a broad product portfolio encompassing the latest cutting edge solutions.
SECO is developing state-of-the-art solutions suitable for the most advanced applications. Let’s talk about the newest standard from PICMG®: COM-HPC™.
HPC technology, acronym for High Performance Computer, is focused on the development of parallel processing algorithms and systems, incorporating computational administration and parallel techniques.
Most modern applications demand high performance due to the amount of data that needs processing, usually requiring video stream and up to 8K resolution. Just to cite some examples: IoT devices, edge-computing, 5G traffic, robotics, smart factory, and safety/mission critical applications.
The new standard for COM modules by PICMG®emerges from the needs of these increasingly demanding markets, in line with the performance and speeds of the newest processors, delivering high computation and low-latency features, and is expected to provide the hardware capabilities required for the most advanced processing and high power applications, with new high-speed connectors able to support existing Gen3, Gen4 and future Gen5 PCI Express interfaces.
This new standard from PICMG® will soon be part of the new technology based on supercomputers and parallel processing to solve complex computational problems, and SECO will enrich its portfolio with this new product type. The COM-HPC™ will not replace the COM Express™: the previous standard will still be suitable for application requiring less data to be processed.
The COM-HPC™ modules will be available in two versions, for different performance requirements: COM-HPC™ / Server and COM-HPC™ / Client.
The first solution from SECO will be a COM-HPC™ / Client. These modules will be available in three overall dimensions with 95 x 120 mm, 120 x 120 mm, and 160 x 120 mm and can be used for high-end applications in integrated IT, supporting next generation high speed interfaces such as PCIe Express 4.0 and USB4, also featuring a maximum of 2 Gigabit Ethernet interfaces (via NBASE-T) for the Ethernet connection. COM-HPC™ / Client modules have integrated video interfaces such as 3xDDI and 2xMIPI-CSI, which can manage up to four separate high resolution displays.
SECO is updating its portfolio with this new line of products starting with a cutting-edge COM-HPC™ / Client solution, to continue offering its clients the most advanced solutions.
About SECO
SECO Group excels in the electronic embedded field, offering cutting-edge solutions for the widest range of applications through standard modules, SBCs, systems and full-custom services, with a strong focus on IoT. Understanding that a project goes beyond the embedded board, SECO is able to provide project management services supporting customers at every stage, from development to mass production and distribution, to achieve the best solution for their needs, whether the project requires complete custom design services, component sourcing, hardware and software development, custom enclosures, full assembly or sub-assembly, validation & verification services and product certifications. This can be achieved thanks to the experience of SECO’s R&D departments in both ARM and X86 architectures and strategic partnerships with several major scientific Universities and world-leading companies such as Intel®, AMD, NXP, NVIDIA®, Xilinx®, Rockchip and Wind River. With 40+ years of experience, SECO is constantly growing and operates globally with offices in Italy, Germany, USA, India, Russia and Taiwan.
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