February 20, 2020
In this edition of embedded world exhibition & conference, SECO will be showcasing many innovative solutions including products based on the latest AMD Ryzen™ Embedded Processors, i.e. the COMe-B75-CT6 and the COMe-C89-CT6. Based respectively on AMD Ryzen™ Embedded V1000 and R1000 Processors, these products stand out for their leading-edge security, support for 4K displays, VP9 decode and high scalability. Let’s take a closer look.
The COMe-B75-CT6 is a COM Express™ Compact 3.0 Type 6 Module provided with the AMD Ryzen™ Embedded V1000 Processor, ensuring top performance thanks to up to four “Zen” CPU cores, and up to 11 “Vega” Compute Units and support for DirectX® 12. It can drive up to four independent displays at the same time. The COMe-B75-CT6 takes advantage of a huge variety of connectivity options, featuring 4x USB 3.0, 8x USB 2.0, 4x PCI-e x1 Gen3 lanes and PEG x8 Gen3. Finally, the module embeds two DDR4 SO-DIMM slots supporting DDR4-3200 ECC memory. The product is a perfect solution for biomedical and medical devices, digital signage & infotainment, and gaming.
Continuing on the COM Express™ Compact 3.0 Type 6 form factor, the COMe-C89-CT6 is equipped with the AMD Ryzen™ Embedded R1000 Processor family of SoCs, and support for DirectX® 12. This COM Express™ is broad in connectivity options, provided with 4x USB 3.0, 8x USB 2.0, up to 5x PCI-e x1 and PEG x4 Gen3. As for memory, the board is equipped with Two DDR4 SO-DIMM slots supporting DDR4-2400 ECC Memory. All these features make this board ideal for the digital signage, gaming, and biomedical fields.
Coming to the SBC form factor, SECO will present the SBC-C90, a single board computer supporting AMD Ryzen™ Embedded V1000 and R1000 SOCs, with support for support for DirectX® 12. When it comes to connectivity, this board is equipped with 2x GbE, M.2 WWAN and WLAN slots, 2x USB3.0, 2x USB 2.0 and 8x GPIO pins. Two DDR4 SO-DIMM slots are provided, supporting DDR4- 3200/2400 ECC and non-ECC Memory. Thanks to the powerful performance of the AMD Ryzen™ Embedded platform and its flexible connectivity, this board is particularly suitable for applications like digital signage, edge computing, gaming, HMI, and industrial automation.
Another impressive product from the COM Express™ family displayed by SECO will be the COMe-C42-BT7, a COM Express™ Rel. 3.0 Basic Type 7 module with the AMD EPYC™ Embedded 3000 Processor. The main features of this new processor are I/O integration, flexibility, and security features, making it a great choice for development.
The COMe-C42-BT7 provides scalability with outstanding performance. Networking and connectivity are enhanced with the 4x 10GBASE-KR interfaces + 1x 1GbE port with NC-SI, the 4x USB 3.1 and 24x PCI-e Gen3 lanes. Moreover, the performance is improved by the four DDR4 SO-DIMM slots supporting DDR4-2666 memory with ECC, up to 128GB. Being a modular COM Express™ Type 7 solution dedicated to high-end families of processors, with high computing capability, bandwidth and low power consumption, this innovative solution ensures the right flexibility to design solutions such as rugged edge servers to be placed in the production lines’ proximity, 5G base stations and autonomous driving systems.
As in previous editions, also this year SECO has put everything in place to bring its latest product additions to the leading international conference in embedded computing.
From February 25th to 27th, SECO is happy to welcome visitors to its stand 1-330 at embedded world 2020 in Nuremberg.
About
SECO
SECO Group excels in the electronic embedded field,
offering cutting-edge solutions for the widest range of applications through
standard modules, SBCs, systems and full-custom services, with a strong focus on IoT.
Understanding that a project goes beyond the embedded board, SECO is
able to provide project management services supporting customers at every stage,
from development to mass production and distribution, to achieve the best
solution for their needs, whether the project requires complete custom design
services, component sourcing, hardware and software development, custom
enclosures, full assembly or sub-assembly, validation & verification
services and product certifications. This can be achieved thanks to the
experience of SECO’s R&D departments in both ARM and X86 architectures and
strategic partnerships with several major scientific Universities and world-leading
companies such as Intel®, AMD, NXP, NVIDIA®, Xilinx®, Rockchip and Wind River.
With 40+ years of experience, SECO is constantly growing and operates globally
with offices in Italy, Germany, USA, India, Russia and Taiwan.
www.seco.com
AMD, the AMD Arrow logo, EPYC, Ryzen, Radeon and combinations thereof are trademarks of Advanced Micro Devices, Inc. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
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