EKF: CompactPCI® Serial R3 specification is now ratified and available
March 7, 2025
Hamm, Germany – March 04, 2025: The PICMG (PCI Industrial Computer Manufacturers Group) has released the CompactPCI® Serial R3 specification. Revision 3 is an extension of CompactPCI® technology, [...]
congatec launches COM Express Compact module with brand new Intel® Core™ Ultra processors
December 20, 2023
Next-generation AI computing for the edge Deggendorf, Germany, 20 December 2023 * * * congatec – a leading vendor of embedded and edge computing technology – is introducing its latest […]
COMh-caRP and COMh-ccAS: Kontron advances industrial High-Performance Computing
March 12, 2023
New COM-HPC® Client modules based on 13th Gen Intel® Core™ mobile and desktop processors for demanding multi-core applications Ismaning, Germany, 2023 – Kontron, a leading global provider [...]
Sealevel to Showcase Latest in COM & I/O Portfolio at Embedded World 2023
March 12, 2023
LIBERTY, SC, USA February 21, 2023 – Sealevel Systems, an industry-leading developer and manufacturer of industrial I/O and embedded computing solutions, will premier its newest solutions at [...]
