Highlights:

• The multi-part virtual event will show attendees how to take advantage of PICMG’s next-generation computer on module specification family for intelligent edge use cases.
• Sessions will address how the Mini form factor enhances performance in mobile-friendly deployments, new features like the updated COM-HPC connector, and a new Carrier Design Guide.
• Attend for free on June 4^th at 14:00 UTC at https://t.ly/COM-HPCMiniAcademy.

MAY 29, 2024 — WAKEFIELD, MA. PICMG, the consortium driving open standards for modular, scalable computing, will be hosting a COM-HPC Mini Academy on Tuesday, June 4 at 14:00 UTC. This multi-part virtual event will span four sessions and introduce participants to the new COM-HPC Mini form factor’s features, including details of the Mini’s updated Carrier Design Guide, as well as examine use cases, design questions, and deployment challenges.

“Between converged network rollouts and advances in artificial intelligence, the hardware requirements for edge computing have changed,” said Doug Sandy, CTO of PICMG. “Modern edge workloads need a combination of high-end computing, power consumption management, and low-latency data transmission. The COM-HPC Mini addresses these requirements, and our Mini Academy will teach developers everything they need to know about how the specification brings the intelligent edge to life.”

The event will be divided into four sessions covering the following topics:

• How COM-HPC Mini improves performance in mobile-friendly deployments.
• The importance of support for CPU, GPU, FPGA and heterogenous processor architectures in diverse edge applications.
• Details on new features in COM-HPC and how they enable greater bandwidth, lower latency, more rugged designs, and interoperable high-speed chip-to-memory interconnects.
• How the updated Carrier Design Guide streamlines development and deployment of cost-optimized, low-to-mid volume production runs.

More details on each session can be found below:

Session 1: June 4^th at 14:00 UTC—What’s New in COM-HPC?

The first Mini Academy session, co-hosted by representatives from congatec, Samtec, and the University of Bielefeld, provides an update on COM-HPC and how it can help organizations transform their edge infrastructure. Alongside updates to the COM-HPC specification family, the session will explore potential PCIe Gen 6 support, CXL 3.1 compatibility, and Functional Safety (FuSa) capability.

Session 2: June 4^th at 14:30 UTC—Introducing COM-HPC Mini

Co-presented by Richard Pinnow of ADLink and Christian Engels of Avnet Embedded, this session will detail how COM-HPC Mini provides system architects with greater speed and performance in a smaller form factor. Participants can expect a review of the new specification’s electromechanical features, followed by demonstrations of how they can leverage those features for far edge mobile and battery powered use cases, such as AMRs, HMIs, drones, and robotic controllers.

Session 3: June 4^th at 15:00 UTC—Exploring the COM-HPC Mini Design Guide

Presented by Kontron’s Peter Hunold, this session introduces the updated Carrier Design Guide developed specifically for the COM-HPC Mini specification. Participants will be given an overview of how the COM-HPC Design Guide has changed from previous versions. The session will conclude by demonstrating how to design in advanced signals, like multiplexed USB 4.0 and how to quickly and efficiently produce Gerber files that define lasting COM-based systems.

Session 4: June 4^th at 15:30 UTC—The COM-HPC Mini Academy: A Multi-Vendor Outlook Panel

Co-hosted by several of the suppliers responsible for developing the COM-HPC Mini specification, this discussion panel will field questions from attendees about designing and deploying the new standard. Participants will also learn about the differences between COM Express and COM-HPC, along with best practices for designing the COM-HPC Mini into real-world applications. The session will then conclude with insight into PICMG’s technology roadmaps.

Going Beyond the Intelligent Edge

“First ratified in 2021, COM-HPC was designed to address the challenges and fulfill the requirements of embedded system architects,” explained Sandy. “COM-HPC Mini continues this trend, introducing a new form factor and features like expanded connectivity support, efficient thermal management, and soldered memory.”

“Open, interoperable, and available from multiple suppliers, COM-HPC Mini provides a path forward for edge computing that will remain relevant for decades,” he added, inviting anyone interested in learning more about COM-HPC Mini and other specifications to visit PICMG’s website.

Recordings of the COM-HPC Mini Academy sessions will be available on-demand for those unable to attend the live event.

Learn More

• Event Registration: https://t.ly/COM-HPCMiniAcademy
• COM-HPC Overview: https://www.picmg.org/openstandards/com-hpc/
• Carrier Design Guide: https://www.picmg.org/wp-content/uploads/PICMG_COM-HPC_CDG_R2_1.pdf
• COM-HPC Mini: https://www.picmg.org/openstandards/com-hpc

About PICMG

Founded in 1994, PICMG is a not-for-profit 501(c) consortium of companies and organizations that collaboratively develop open standards for high performance industrial, Industrial IoT, military & aerospace, telecommunications, test & measurement, medical, and general-purpose embedded computing applications. There are more than 150 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, single board computer design, high-speed signaling design and analysis, networking expertise, backplane, and packaging design, power management, high availability software and comprehensive system management.

Key standards families developed by PICMG include COM-HPC, COM Express, COM-HPC Mini, CompactPCI, AdvancedTCA, MicroTCA, AdvancedMC, CompactPCI Serial, InterEdge, ModBlox7, SHB Express, MicroSAM, and HPM (Hardware Platform Management). For more information, visit https://www.picmg.org.

• Partnership seeks to reduce technology integration, maintenance, and upgrade costs in the process automation industry.
• Work supports the Open Process Automation™ Standard (O-PAS), a standard of The Open Group^®, that defines resilient and scalable process automation system architectures.
• Collaboration establishes a multi-vendor ecosystem for interoperable, interchangeable edge hardware via specifications like InterEdge.

APRIL 24, 2024 — WAKEFIELD, MA. PICMG, the consortium for open hardware specifications, has entered a liaison partnership with The Open Group Open Process Automation™ Forum (OPAF) to collaboratively develop interoperable, interchangeable technology specifications for the process control industry. The partnership fills a gap in edge controller hardware that exists in the O-PAS™ Standard—an open architectural framework for developing industrial process automation systems, currently being defined by OPAF initiatives.

Governed by The Open Group, OPAF membership is comprised of 110+ member organizations, including companies like Exxon Mobil, Schneider Electric, Phoenix Contact, Intel, and others. These companies work collaboratively to address the needs of end users in the process control market through initiatives like the O-PAS Standard. The O-PAS framework references existing standards wherever possible or, in the absence of such standards, works with associated organizations to achieve proper standard definition.

To complete and standardize work on an edge controller performed by OPAF member Georgia Tech Research Institute (GTRI), The Open Group Forum evaluated several hardware standards development organizations. The OPAF Members selected PICMG to develop a new open edge hardware technology specification that defines electromechanical interoperability, interchangeability, hot plug capabilities, and compatibility with existing standards such as IEC 61499 and IEC 61131.

The result was the recently ratified InterEdge specification.

Collaborative Standards Development Yields InterEdge Specification

Founded in 1994, PICMG is a consortium of more than 150 member companies that defines open, interoperable, and multi-vendor technology specifications for high-performance embedded computing platforms. With a heritage of specifications that span edge-to-cloud use cases, including CompactPCI, AdvancedTCA, and COM Express, PICMG brings a proven process and track record of successfully producing lasting, quality technology specifications.

“During development of the O-PAS Standard, we realized the need for physical hardware that provided interchangeability in an interoperable way,” explained David DeBari, Process Control Engineering Associate at ExxonMobil. “Because our focus is primarily on the software side, we opted to bring in third-party expertise. PICMG was the organization that best fit our needs in that regard—a lot of our suppliers were involved with them already, so working together was the natural choice.”

The InterEdge specification introduces a modular open architecture that delivers state-of-the-art I/O abstraction and flexibility and in a common physical form factor. It supports the OPAF and O-PAS goals of reducing integration, maintenance, and upgrade costs in the highly fragmented and largely proprietary process control technology market.

Collaboration for A More Open Industry

The OPAF and PICMG relationship is ongoing, with work on new versions of the InterEdge specification already underway. Meanwhile, the Open Process Automation Forum has introduced InterEdge to its physical platform subcommittee, who plan to include the specification in an upcoming revision of the O-PAS Standard and devise a set of tests that evaluate conformance to the InterEdge specification.

“Through standardization, proprietary physical interfaces are quickly becoming a thing of the past. The InterEdge standard from PICMG is the first step in that transition for process automation industry end users. Enabling hardware interchangeability allows end users to select components based on performance characteristics instead of physical interface compatibility. We look forward to seeing this key quality attribute normatively referenced in the O-PAS standard,” added Aneil Ali, Forum Director of The Open Group Open Process Automation Forum.

“Our relationship with PICMG is invaluable. It is industry changing,” said Steve Bitar, former ExxonMobil automation advisor and secretary of the PICMG InterEdge working group. “And we already know that some of our vendors will use—or are already using—other PICMG standards like COM-Express and COM-HPC. That level of collaboration and integration brings us a step closer to our vision—an industry built on open architecture standards and qualifications that are supported by end users, suppliers, and integrators alike.”

Learn More

The InterEdge specification is available now and can be purchased from the PICMG website for $750. For more information on the OPAF-PICMG liaison relationship, the   O-PAS standard, or InterEdge, visit:

• The Open Process Automation Forum: https://www.opengroup.org/forum/open-process-automation-forum
• PICMG Website: picmg.org
• O-PAS Standard Download Page: https://publications.opengroup.org/standards/opa/c230
• InterEdge Overview: https://www.picmg.org/openstandards/interedge
• E-mail: in**@pi***.org.

About The Open Group Open Process Automation Forum (OPAF)

The Open Process Automation Forum (OPAF) is an international forum of end users, system integrators, suppliers, academic institutions, and other standards organizations working together to develop a standards-based, open, secure, and interoperable process control architecture. The Forum is part of The Open Group, a global consortium that enables the achievement of business objectives through technology standards. Our diverse membership of more than 900 organizations includes customers, systems and solutions suppliers, tool vendors, integrators, academics, and consultants across multiple industries. For more information, go to https://www.opengroup.org.

About PICMG

Founded in 1994, PICMG is a not-for-profit 501(c) consortium of companies and organizations that collaboratively develop open standards for high performance industrial, Industrial IoT, military & aerospace, telecommunications, test & measurement, medical, and general-purpose embedded computing applications. There are more than 150 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, single board computer design, high-speed signaling design and analysis, networking expertise, backplane, and packaging design, power management, high availability software and comprehensive system management.

Key standards families developed by PICMG include COM-HPC, COM Express, CompactPCI, AdvancedTCA, MicroTCA, AdvancedMC, CompactPCI Serial, InterEdge, ModBlox7, SHB Express, MicroSAM, and HPM (Hardware Platform Management). For more information, visit https://www.picmg.org

PICMG: Can you describe your work outside of PICMG as well as the role you played in development of the COM-HPC specification? 

JENS: I am currently engaged in research at Bielefeld University, focusing on the development of heterogeneous and reconfigurable computing technologies for a wide range of applications. These include the Internet of Things (IoT), edge computing, cloud computing, and high-performance computing (HPC).

My involvement with the early stages of the COM-HPC specification centered on leading the development of the Platform Management Interface Specification and expanding the Embedded EEPROM Specification for COM-HPC. 

PICMG: You recently raised awareness about the CXL standard within the COM-HPC community. What is CXL and why is it relevant for PICMG COM-HPC developers and users?

JENS: CXL, or Compute Express Link, is a high-speed, high-capacity interconnect standard that facilitates efficient communication between CPUs, memory, and peripherals using the PCIe physical layer. Its support for cache coherency, disaggregation, and scalable architectures makes it a compelling choice for modular form factors like COM-HPC, driving its popularity among developers and users seeking advanced computing solutions.

PICMG: Why is CXL 3.1 significant in the context of COM-HPC? What use cases or capabilities will it drive in the COM-HPC ecosystem?

JENS: CXL introduces features that cater to the demanding requirements of cloud and high-performance computing systems. Its emphasis on scalable architectures, disaggregation, and cache coherency is particularly relevant for COM-HPC, offering the potential to revolutionize the way modular computing platforms are designed and utilized. 

The integration of CXL into COM-HPC could facilitate the development of more sophisticated computing solutions, enabling the seamless coupling of specialized accelerators and the establishment of cache-coherent multi-socket systems. These advancements promise to unlock new possibilities for COM-HPC applications, ranging from data-intensive analytics to AI and machine learning workloads, driving innovation in modular computing technologies.

PICMG: Given that CXL targets PCIe, has it been compatible with COM-HPC to date?

JENS: The relationship between CXL and COM-HPC is fundamentally influenced by CXL’s reliance on the PCIe physical layer for connectivity. This means that while direct compatibility between previous versions of CXL and COM-HPC has not been explicitly defined, the architectural underpinnings allow for potential integration. 

The absence of CXL in the current COM-HPC specification, coupled with the lack of support in existing modules, suggests that the integration of CXL represents a forward-looking opportunity for enhancing COM-HPC. Such integration is anticipated to require minimal modifications to the specification, paving the way for future advancements in modular computing.

PICMG: What does the COM-HPC community need to know about the CXL market or technical requirements to capitalize on the opportunity?

JENS: To fully leverage the potential that CXL brings to the COM-HPC community, it is crucial to understand the intricacies of CXL’s market dynamics and technical specifications. This involves a deep dive into the architecture of CXL, including its device types—such as Type 1 for I/O devices, Type 2 for cache-coherent devices, and Type 3 for memory expander devices. Additionally, understanding the topology options that CXL supports, including switch-based topologies for larger, more complex systems, can empower developers to design COM-HPC solutions that are both innovative and future-proof. 

Staying abreast of the evolving CXL specifications and market trends will enable the COM-HPC community to identify new opportunities for integration and application, ensuring that COM-HPC modules remain at the forefront of technological advancement.

PICMG: What are you and Bielefeld University doing with respect to CXL today?

JENS: We are working on integrating CXL within the RISC-V ecosystem, a venture that holds promising implications for the future of computing architectures. Our work focuses on the development of innovative bridge technologies that facilitate communication between the RISC-V Coherent Hub Interface (CHI) and CXL, using FPGA-based modules, which we refer to as microservers. 

This endeavor is not just about bridging two technical standards; it’s about creating a foundation for next-generation computing platforms that can seamlessly integrate diverse processing and memory resources. By developing these bridges, we aim to enable more efficient, scalable, and flexible computing architectures that can cater to the demanding requirements of modern applications, ranging from AI and machine learning to big data analytics.

PICMG: Where can interested parties go to find more information on CXL?

JENS: The CXL Consortium website serves as the primary repository of knowledge. This platform not only provides access to the official CXL specifications and technical documents, but also offers insights into the latest developments, industry adoption stories, and educational resources.

More Information:
• Compute Express Link: https://computeexpresslink.org
•*PICMG COM-HPC Overview: https://www.picmg.org/openstandards/com-hpc
•*PICMG Platform Management Interface Specification: https://www.picmg.org/product/com-hpc-platform-management-interface-specification