Open Standards

New state-of-the-art Computer-on-Modules – The feature set in detail. congatec supports the 11th Gen Intel® Core™ processor, known under the code name Tiger Lake UP3, on COM Express conga-TC570 based on the new low-power high-density SoCs the new modules offer significantly greater CPU performance and nearly 3x higher GPU performance along with state-of-the-art PCIe Gen4.

Designed for the development of embedded computing systems with impressive graphics performance for applications such as medical imaging; professional broadcasting, infotainment and gambling; digital signage; control rooms and video surveillance; optical quality control; and 3D simulators. Other applications include smart robotics and autonomous vehicles that use deep learning to optimize their situational awareness.

This IHS GlobalSpec Online Event webcast will show you how you can go from lab development to production quickly with Acromag’s new innovative COM Express platform of products. Russ will discuss the CPU processor board, carriers, engineering design kit and more.