Industry News

Wakefield, MA., USA / Nuremberg, Germany, June 23, 2022 – PICMG, a leading consortium for the development of open embedded computing specifications, announces that the MicroTCA Working Group is working on the next generation of the MTCA architecture specifications initially launched in 2006. Efforts target improvements for time sensitive and high bandwidth applications such as in high-energy physics. Current work includes accommodations for the next generation of CPUs and FPGAs that will natively support PCIe gen 5. Future applications in industry require this higher bandwidth i.e. for image processing, signal detection, data acquisition. As current CPU speeds are limited by 80 W per slot power limit the support of more power for faster CPUs is on the task list as well. Future applications will also require other kinds of high- and low-speed fabrics paired with more flexibility in system design. The science market segment for high frame rate Megapixel detectors of the actual photon experiments requires even higher throughput. Thus, all these demands are scheduled to become part of the new releases of these successful specifications. With all these improvements MicroTCA continues to be an pro-active specification with significant updates to support high-bandwidth backplane interconnects. Latest update of the specs happened as recently as 2020.

“I am more than happy that the MicroTCA Working Group is so pro-actively addressing the recent demands. The new spec will find its way into many different vertical markets due to the flexibility of MicroTCA!”, says Heiko Koerte, VP and Director Sales & Marketing of N.A.T., “Applications in industrial automation, medical, telecommunication and networking, aerospace and transportation will not only benefit form these new features but also from how easily MicroTCA can be adapted to the exact needs. More than 16.500 MCHs just from N.A.T and many more I/O and compute cards delivered to the field speak for themselves. The wide spread of MicroTCA definitely makes it both a technically and commercially attractive solution!”.

About MicroTCA

MicroTCA® is a modular, open standard for building high-performance, backplane-based switched fabric computer systems in a small form factor.

MicroTCA has become the de facto standard for precision timing and synchronization equipment at world-renowned particle accelerators CERN, DESY, ESS, XFEL, KEK, SLAC, and others. Its architecture and features are also consistent with the Modular Open Systems Approach (MOSA) being adopted as part of the U.S. Department of Defense (DoD) electronic media acquisition policy.

Originally designed for edge telecom and networking use cases, the core MTCA.0 base specification defines the mechanical and electrical characteristics of a MicroTCA backplane, card cage, power subsystem, cooling, and system management. Since being ratified in 2011, the MTCA Base specification has been revised to support 10GBASE-KR and 40GBASE-KR4 Ethernet fabrics and spawned four additional sub-specifications adapted for data acquisition, control, and telemetry in markets such as high-energy physics, avionics, defense, mobile infrastructure, and others.

• MicroTCA.0 – The Base specification defines MicroTCA’s electrical, mechanical, thermal, and management characteristics, including support for implemented in MicroTCA.0 Revision 2.0 in 2020.

• MicroTCA.1 – Adds ruggedization features and forced-air cooling.

• MicroTCA.2 – Expands shock, vibration, and temperature operation, allowing for both air and conduction cooling.

• MicroTCA.3 – Continues to increase compliance threshold for shock, vibration, and temperature and requires the use of conduction cooling.

• MicroTCA.4 – Adds features for the scientific community such as Rear Transition Modules (RTMs), which improve RF filtering, pre- and post-processing, clock generation, etc.

Developed as a reduced-footprint alternative to the popular AdvancedTCA family of specifications, MicroTCA defines a backplane-based system for plug-in Advanced Mezzanine Cards (AdvancedMCs). AdvancedMCs are available in different sizes (Full-size, Mid-size, Compact) and can be sourced from multiple vendors to add compute, storage, I/O, and other functionality to a MicroTCA chassis without modification. As mentioned previously, the MTCA.4 sub-specification also adds support for RTMs that increase system expansion possibilities in scientific applications.

A single MicroTCA system contains up to 12 AdvancedMCs slots, and up to two MicroTCA Carrier Hubs (MCHs). MCHs provide intelligent platform management, power delivery, and facilitate switching over Ethernet, PCIe, and/or Serial RapidIO backplane interconnect fabrics.

To learn more about the PICMG MicroTCA family of specifications, download the Short Form Specification for free at https://www.picmg.org/wp-content/uploads/MicroTCA_Short_Form_Sept_2006.pdf. You can also purchase Revision 2.0 of the MicroTCA Base Specification for $750 from https://www.picmg.org/product/microtca-base-specification-r2-0.

The current committee is led by Kay Rehlich of DESY, Heiko Koerte of N.A.T. and Thomas Holzapfel from powerBridge.

About PICMG
Founded in 1994, PICMG is a not-for-profit 501(c) consortium of companies and organizations that collaboratively develop open standards for high performance industrial, Industrial IoT, military & aerospace, telecommunications, test & measurement, medical, and general-purpose embedded computing applications. There are over 130 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, single board computer design, high-speed signaling design and analysis, networking expertise, backplane, and packaging design, power management, high availability software and comprehensive system management.

Key standards families developed by PICMG include COM Express, COM-HPC, ModBlox7, IoT.1, CompactPCI, AdvancedTCA, MicroTCA, AdvancedMC, CompactPCI Serial, COM Express, SHB Express, MicroSAM, and HPM (Hardware Platform Management). https://www.picmg.org

Wakefield, MA., USA / Nuremberg, Germany, June 23, 2022 – The PCI Industrial Computer Manufacturer’s Group (PICMG), a leading consortium for the development of open embedded computing specifications, is excited to announce significant progress on its IoT.X family of specs. Highlighted by the IoT.1 firmware interface and data modeling specification and soon-to-be-ratified IoT.2 network architecture, ongoing efforts promise to abstract low-level device physics such that sensor node data becomes interoperable across all levels of smart factory deployments.

PICMG IoT.1 focuses primarily on a data abstraction layer that allows users to turn traditional sensors and effecters into plug-and-play smart sensors and effecters using free and open-source tools that require little-to-no programming expertise. For example, the PICMG IoT Configurator and IoT Builder tools are reference implementations for building and generating smart sensor firmware that can be read by any sensor or controller.

Both can be accessed from the PICMG Github repos

The separate but complementary IoT.2 network architecture specification defines the integration of these smart sensors and effecters, as well as their data, into larger Industry 4.0 systems of systems. Based on the Data Management Task Force’s (DMTF’s) Redfish API, the .2 spec outlines an abstraction layer and transactional model so that sensor and effecter endpoints can be monitored and managed in the context of job models similar to those available from major cloud service providers.

In other words, the data transparency afforded by the two specifications permits IT factory personnel to send specific, state-based jobs to a machine or clusters of machines in the pursuit of a desired outcome.

“IoT.1 provides low-level visibility of physical device parameters that can directly impact the quality and efficiency of your production line,” says Doug Sandy, CTO, PICMG. “IoT.2 provides an IT-like interface for managing both machines and jobs at a high level of abstraction.

“When used together, they support the analytics required for higher levels of productivity and throughput across a factory environment,” he adds.

To foster an environment of openness and collaboration, IoT.2 will not be exclusive of other existing IoT communications protocols and models and allows them to be converted to maintain compliance with the new spec.

For more detailed technical information on IoT.1, IoT.2, and how PICMG’s latest family of specifications is helping accelerate Industry 4.0 adoption, please visit PICMG’s website www.picmg.org/understanding-smart-sensors. More information on PICMG’s overall Industrial IoT activities can be found at www.picmg.org/industrial-iot-overview.

IoT.1 was developed in collaboration with the following PICMG members: Arroyo Technology, nVent, Triple Ring Technologies, Sandy Systems. The IoT.1 specification can be purchased and downloaded here: www.picmg.org/product/iiot_firmware.

About PICMG

Founded in 1994, PICMG (PCI Industrial Computer Manufacturers Group) is a nonprofit consortium of companies and organizations that collaboratively develop open standards for high performance telecommunications, military, industrial, and general-purpose embedded computing applications. There are over 140 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, single board computer design, very high-speed signaling design and analysis, networking expertise, backplane and packaging design, power management, High Availability software, and comprehensive system management. Key standards families developed by PICMG include CompactPCI CompactPCI®, AdvancedTCA®, MicroTCA®, AdvancedMC®, CompactPCI® Serial, COM Express®, SHB Express®, MicroSAM, COM-HPC. and HPM (Hardware Platform Management).

Wakefield, MA., USA / Nuremberg, Germany, June 23, 2022 – PICMG – a leading consortium for the development of open embedded computing specifications – announces two new specifications for the high-end Computer-on-Module standard COM-HPC. They target mixed-critical functional safety applications and small form factor designs requiring credit card-sized modules.

COM-HPC Client Mini

Like COM Express Mini, the COM-HPC Client Mini specification will define the use of one connector instead of the two implemented for the larger modules (Sizes A -E). But with COM-HPC, half the number of signal pins still means 400 signal lanes, which equals 90% of the capacity that COM Express Type 6 modules offer. Compared to COM-HPC Client Size A modules, the smallest available COM-HPC form factor, COM-HPC Mini, also reduces the footprint to 50%. Such extremely small modules measuring only 60 x 95 mm are required for high-end embedded computer logic in devices such as top-hat rail PCs for control cabinets in building and industrial automation, or portable test and measurement devices. In addition, the new specification will enable engineers to integrate state-of-the-art computer interface technologies such as PCIe Gen4 and Gen5 into ultra-small processing units that provide highest performance. As the new specification will come with a focused high-performance pinout and will comply with the entire COM-HPC ecosystem, it is expected to become the high-end standard extending the PICMG’s earlier COM Express Mini standard. PICMG expects the COM Express specification to continue leading the COM market for many years as it meets numerous standard application requirements now to be allocated in the mid-range performance sector.

FuSa support: COM-HPC
The new version of COM-HPC defines signal pinouts to support FuSa (Functional Safety) applications. These applications include safety critical machine control, autonomous vehicles and robotics, transportation related hardware such as train and wayside control, avionic equipment and much more.

The new extensions for functional safety (FuSa) target an even more promising market: Connected device developers want to utilize x86 processor technologies to be able to execute mixed-critical applications on multi-core processors. This requires redundancy and the possibility of implementing fail-safe processes. With the new functional safety extensions, COM-HPC is thus entering a market that is expected to accelerate the demand for embedded Computer-on-Modules significantly. Besides functional safety control applications that require an IoT and industry 4.0 gateway, it also targets collaborative robotics working closely with humans. Further markets arise from the demands of automated intralogistics with autonomous logistic vehicles and stretch from factory mobility to any new market that can be found in autonomous driving, from agricultural and construction machinery to smart city vehicles and AUVs as well as UAVs. Of course, the functional safety extensions are supported across all COM-HPC form factors, including the upcoming COM-HPC Client Mini.

„With the small size definition of the COM-HPC Client Mini and the FuSa extensions, COM-HPC covers all embedded use cases I can think of. COM-HPC is the most complete computer module definition ever. I expect an extremely fast growth for scalable and compute-power hungry embedded applications based on COM-HPC technology.“ Christian Eder, Chair of the COM-HPC technical committee and Congatec Director Product Marketing.

The FuSa specification in detail
FuSa versions of some contemporary chipsets or System-on-Chips (SoCs) incorporate a FuSa “Safety Island”. This is a specialty portion of the hardware – along with supporting firmware and software – that is separate from the main portion of the chipset or SoC. The Safety Island monitors the health and status of the main chipset or SoC and can report any findings over a dedicated FuSa GPIO and dedicated FuSa SPI Slave interface to an external carrier based FuSa System Safe State Agent and optionally a Safety Controller. The FuSa “Safety Controller” is a carrier based microcontroller that collects safety and status information from the Safety Island over a dedicated SPI bus and processes it for external use. The Safety Controller is the FuSa SPI Master.

The efforts of both new specifications are sponsored by: congatec, Kontron and ADLINK

About COM-HPC

COM-HPC, a new open Computer-on-Module form factor, targets extremely high I/O and compute performance levels from high-end clients up to the entry server class and beyond. Standard COM-HPC modules plug into a carrier board typically customized to the application. OEM benefits are fast and cost-effective layout with high design security for application-specific embedded and Edge computing boards. As a result, COM-HPC is the right choice for autonomous vehicles, base stations, medical equipment, high-end instrumentation, industrial equipment, casino gaming equipment ruggedized computers for various industrial fields, and more.

About PICMG
Founded in 1994, PICMG is a not-for-profit 501(c) consortium of companies and organizations that collaboratively develop open standards for high performance industrial, Industrial IoT, military & aerospace, telecommunications, test & measurement, medical, and general-purpose embedded computing applications. There are over 130 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, single board computer design, high-speed signaling design and analysis, networking expertise, backplane, and packaging design, power management, high availability software and comprehensive system management.

Key standards families developed by PICMG include COM Express, COM-HPC, ModBlox7, IoT.1, CompactPCI, AdvancedTCA, MicroTCA, AdvancedMC, CompactPCI Serial, COM Express, SHB Express, MicroSAM, and HPM (Hardware Platform Management). https://www.picmg.org