With Release 3 of the CompactPCI Serial specification, PICMG doubles the bandwidth and speed of CompactPCI Serial applications. This benefits sectors such as aerospace, industry and automotive.

Wakefield, MA. March 11, 2025. PICMG – a leading consortium to develop innovative open standards in embedded computing – today announces the release of CompactPCI Serial^® Revision 3 (CPCI-S.0 R3.0). With the third revision of the standard, the organization is ensuring future viability and scalability for many years to come. CompactPCI Serial^® was originally developed as an extension of the open CompactPCI^® standard to meet the demand for robust, modular and powerful computer systems in industrial and embedded applications. The combination of high performance, modularity and robustness has made CompactPCI Serial^® a popular standard for industrial applications, automation, and much more – where robustness, interoperability and use in harsh environments with comprehensive connectivity are crucial.

CompactPCI supports serial data transfer rates via PCI Express, USB, and Ethernet, a robust design with AirMax connectors and full interchangeability with CompactPCI cards via 3U/6U slot card systems. Developers can look forward to the completely new opportunities offered by revision 3 compared to revision 2, which are among others:

• Full PCI Express (PCIe) support: While R2 supported PCI Express up to Gen3 with 8 GT/s, R3 extends support to PCI Express Gen4 with 16 GT/s, which means increasing speed by doubling the data rate.
• USB support: USB interface support has been increased from USB 3.0 (Gen1) with 5 Gb/s in R2 to USB 3.1 (Gen2) with 10 Gb/s in R3, doubling the bandwidth.
• Ethernet: R3 introduces support for 10GBASE-T and 10GBASE-KR Ethernet, enabling higher bandwidth network speeds.
• Connectors: In order to realize these higher data rates, new AirMax VSe^® high-speed connectors for CPU boards are used in R3 instead of AirMax VS^® in Release 2. These connectors are fully upwards and downwards compatible.

“I am very proud that with Revision 3 of the specification, we have managed to provide all embedded integrators with better CompactPCI Serial performance. Developers can look forward to better connectivity, higher performance and much better scalability,” said Jess Isquith, President of PICMG.

The CompactPCI specification defines a modular computer system, consisting of a backplane, a system slot, and up to 24 peripheral boards. The mechanical design is fully backward compatible to CompactPCI^® and will interoperate with existing systems. A system slot board can be used in a peripheral slot as well to do multiprocessing. The easiest way to communicate in this case is via Ethernet. Ethernet uses cable standards ‘xxBase-T’ instead of dedicated backplane standards. This lowers the cost, guarantees better interoperability and offers currently up to 10 Gb/s data throughput. Plus, implementation of the Ethernet connection of a system board can be done with a mezzanine board (3U or 6U). Due to this concept, more flexibility will be achieved, because the usage of Ethernet does not depend on the system board itself.

CompactPCI Serial can be combined with existing CompactPCI boards by using a CompactPCI PlusIO system slot card. These hybrid systems offer an ideal migration path from parallel to serial connections. CompactPCI Serial for Space specifically addresses the extreme environment requirements for outer space. Developers who want to build applications for harsh environments in industry, aviation or more can now download the new specification from the PICMG website and start designing immediately. PICMG member companies are also already working on their first products based on the new specification. The release of revision 4 is even in preparation.

PICMG at embedded world:

Hall 5, booth 320A

Additional material can be found here: https://www.picmg.org/openstandards/compactpci-serial/

Revision 3 of CompactPCI Serial can be downloaded here:

https://www.picmg.org/product/compactpciserial-specification-r3/

About PICMG

Founded in 1994, PICMG (PCI Industrial Computer Manufacturers Group) is a nonprofit consortium of companies and organizations that collaboratively develop open standards for high performance telecommunications, military, industrial, and general purpose embedded computing applications. Its original mission was to extend the PCI standard to non-desktop applications. There are over 140 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, single board computer design, very high speed signaling design and analysis, networking expertise, backplane and packaging design, power management, High Availability software, and comprehensive system management. Equipment built to PICMG standards is used worldwide and anyone can build or use equipment without restriction (although certain technologies used for some military applications may be subject to U.S. export restrictions governed by ITAR rules). Key standards families developed by PICMG include CompactPCI®, AdvancedTCA®, MicroTCA®, AdvancedMC®, CompactPCI® Serial, COM Express®, SHB Express®, MicroSAM, COM-HPC. and HPM (Hardware Platform Management).

• Meet ExxonMobil, Schneider Electric, Phoenix Contact, Intel, Samtec and others at embedded world North America on October 8^th to learn how to participate.
• InterEdge Technical Working Group (TWG) to define the specification’s compute module bus, multi-channel I/O modules, and other system architecture elements.
• InterEdge reference architecture will accelerate the development of open and interoperable ecosystem and creation of conformant hardware in 2024.

October 8, 2024 — WAKEFIELD, MA. PICMG, a leading consortium for developing open embedded computing specifications, has announced formation of the InterEdge 1.1 Technical Working Group (TWG). Industry professionals looking to shape future technologies throughout the process industries, including refining, chemical, oil gas, pharmaceuticals, metals and mining, pulp and paper, as well as food and beverage, are encouraged to join the standardization effort by contacting [email protected] or visiting members of the TWG at embedded world North America, October 8-10^th in Austin, TX.

InterEdge is intended for broad process industry use as an alternative to industrial PCs (IPC), programmable logic controllers (PLC), distributed control systems (DCS) and their associated I/O modules. With its modular architecture, InterEdge can consolidate the functions of all of these systems into a single platform.

InterEdge is an open electromechanical and software interface specification designed to support the interchangeability of industrial-grade compute modules, input/output (I/O) modules, and network switches for industrial automation and process control industries. Version 1.1 of the InterEdge standardization effort seeks to build on the mechanical and interface definitions completed previously by defining standard compute modules, multi-channel I/O modules, an InterEdge reference architecture, and more.

”The InterEdge 1.1 TWG is running full speed ahead bringing the benefits of interchangeability to the automation industry,” said Matthew Burns, InterEdge 1.1 Technical Working Group chair. “The collaboration and innovation of industry leaders within the InterEdge community will drive adoption in future system builds for generations to come.”

The primary work performed by the InterEdge 1.1 TWG will include completing definitions of a compute module expansion bus, multi-channel I/O, additional I/O, thermal design, anti-tamper, out-of-band management, additional diagnostics and termination assemblies.

The working group will also define an InterEdge reference architecture that connects multiple compute and I/O modules over an internal Ethernet I/O bus. In compliance with the Open Process Automation Forum’s (OPAF’s) Open Process Automation Standard (OPAS), the reference architecture will support an IEC 61499 runtime on top of a Linux OS. IEEE 802.3 and 10Base-T1S MAC/PHYs are included to support external networking over industrial Ethernet, MQTT, DDS and other protocols.

Reference compute modules are being supplied by ASRock Industrial while the PCB and connectors are being developed by Samtec. I/O module vendors are currently being identified.

“The InterEdge specification enables interoperability and interchangeability to the process automation markets, which previously required companies to choose between proprietary solutions. The work of OPAF to address the broader needs of truly rugged edge applications will allow these markets to deploy greater IoT capabilities, including preventative maintenance, greater reporting and better process efficiencies. PICMG strives to accelerate the adoption of open standards and develop specifications as a consortium or in conjunction with like organizations,” said Jessica Isquith, president, PICMG.

Members of the InterEdge 1.1 TWG will attend the Embedded World North America conference and exhibition in Austin, TX from October 8-10. Companies and organizations interested in learning more about the new PICMG specification, the OPAS standard of which it is a part, or the ways open automation technology is enabling next-generation initiatives like software-defined manufacturing (SDM) can visit the following landing pages:

• picmg.org/openstandards/interedge
• picmg.org/product/interedge

About PICMG
Founded in 1994, PICMG is a not-for-profit 501(c) consortium of companies and organizations that collaboratively develop open standards for high performance industrial, Industrial IoT, military & aerospace, telecommunications, test & measurement, medical, and general-purpose embedded computing applications. There are over 130 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, single board computer design, high-speed signaling design and analysis, networking expertise, backplane, and packaging design, power management, high availability software and comprehensive system management.

Key standards families developed by PICMG include InterEdge, COM-HPC, COM Express, CompactPCI, AdvancedTCA, MicroTCA, AdvancedMC, CompactPCI Serial, SHB Express, MicroSAM, HPM (Hardware Platform Management), and ModBlox7.

For more information, visit www.picmg.org.

Highlights:

• The multi-part virtual event will show attendees how to take advantage of PICMG’s next-generation computer on module specification family for intelligent edge use cases.
• Sessions will address how the Mini form factor enhances performance in mobile-friendly deployments, new features like the updated COM-HPC connector, and a new Carrier Design Guide.
• Attend for free on June 4^th at 14:00 UTC at https://t.ly/COM-HPCMiniAcademy.

MAY 29, 2024 — WAKEFIELD, MA. PICMG, the consortium driving open standards for modular, scalable computing, will be hosting a COM-HPC Mini Academy on Tuesday, June 4 at 14:00 UTC. This multi-part virtual event will span four sessions and introduce participants to the new COM-HPC Mini form factor’s features, including details of the Mini’s updated Carrier Design Guide, as well as examine use cases, design questions, and deployment challenges.

“Between converged network rollouts and advances in artificial intelligence, the hardware requirements for edge computing have changed,” said Doug Sandy, CTO of PICMG. “Modern edge workloads need a combination of high-end computing, power consumption management, and low-latency data transmission. The COM-HPC Mini addresses these requirements, and our Mini Academy will teach developers everything they need to know about how the specification brings the intelligent edge to life.”

The event will be divided into four sessions covering the following topics:

• How COM-HPC Mini improves performance in mobile-friendly deployments.
• The importance of support for CPU, GPU, FPGA and heterogenous processor architectures in diverse edge applications.
• Details on new features in COM-HPC and how they enable greater bandwidth, lower latency, more rugged designs, and interoperable high-speed chip-to-memory interconnects.
• How the updated Carrier Design Guide streamlines development and deployment of cost-optimized, low-to-mid volume production runs.

More details on each session can be found below:

Session 1: June 4^th at 14:00 UTC—What’s New in COM-HPC?

The first Mini Academy session, co-hosted by representatives from congatec, Samtec, and the University of Bielefeld, provides an update on COM-HPC and how it can help organizations transform their edge infrastructure. Alongside updates to the COM-HPC specification family, the session will explore potential PCIe Gen 6 support, CXL 3.1 compatibility, and Functional Safety (FuSa) capability.

Session 2: June 4^th at 14:30 UTC—Introducing COM-HPC Mini

Co-presented by Richard Pinnow of ADLink and Christian Engels of Avnet Embedded, this session will detail how COM-HPC Mini provides system architects with greater speed and performance in a smaller form factor. Participants can expect a review of the new specification’s electromechanical features, followed by demonstrations of how they can leverage those features for far edge mobile and battery powered use cases, such as AMRs, HMIs, drones, and robotic controllers.

Session 3: June 4^th at 15:00 UTC—Exploring the COM-HPC Mini Design Guide

Presented by Kontron’s Peter Hunold, this session introduces the updated Carrier Design Guide developed specifically for the COM-HPC Mini specification. Participants will be given an overview of how the COM-HPC Design Guide has changed from previous versions. The session will conclude by demonstrating how to design in advanced signals, like multiplexed USB 4.0 and how to quickly and efficiently produce Gerber files that define lasting COM-based systems.

Session 4: June 4^th at 15:30 UTC—The COM-HPC Mini Academy: A Multi-Vendor Outlook Panel

Co-hosted by several of the suppliers responsible for developing the COM-HPC Mini specification, this discussion panel will field questions from attendees about designing and deploying the new standard. Participants will also learn about the differences between COM Express and COM-HPC, along with best practices for designing the COM-HPC Mini into real-world applications. The session will then conclude with insight into PICMG’s technology roadmaps.

Going Beyond the Intelligent Edge

“First ratified in 2021, COM-HPC was designed to address the challenges and fulfill the requirements of embedded system architects,” explained Sandy. “COM-HPC Mini continues this trend, introducing a new form factor and features like expanded connectivity support, efficient thermal management, and soldered memory.”

“Open, interoperable, and available from multiple suppliers, COM-HPC Mini provides a path forward for edge computing that will remain relevant for decades,” he added, inviting anyone interested in learning more about COM-HPC Mini and other specifications to visit PICMG’s website.

Recordings of the COM-HPC Mini Academy sessions will be available on-demand for those unable to attend the live event.

Learn More

• Event Registration: https://t.ly/COM-HPCMiniAcademy
• COM-HPC Overview: https://www.picmg.org/openstandards/com-hpc/
• Carrier Design Guide: https://www.picmg.org/wp-content/uploads/PICMG_COM-HPC_CDG_R2_1.pdf
• COM-HPC Mini: https://www.picmg.org/openstandards/com-hpc

About PICMG

Founded in 1994, PICMG is a not-for-profit 501(c) consortium of companies and organizations that collaboratively develop open standards for high performance industrial, Industrial IoT, military & aerospace, telecommunications, test & measurement, medical, and general-purpose embedded computing applications. There are more than 150 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, single board computer design, high-speed signaling design and analysis, networking expertise, backplane, and packaging design, power management, high availability software and comprehensive system management.

Key standards families developed by PICMG include COM-HPC, COM Express, COM-HPC Mini, CompactPCI, AdvancedTCA, MicroTCA, AdvancedMC, CompactPCI Serial, InterEdge, ModBlox7, SHB Express, MicroSAM, and HPM (Hardware Platform Management). For more information, visit https://www.picmg.org.