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In this video, Henk van Bremer, Director of Boards and Modules at ADLINK, focuses on the server module, which solves many of the issues associated with bringing server level computing to the edge, especially the power that’s needed to drive some of the latest microprocessors.

In this video, Burrell Best, Industry Standards Manager at Samtec, explains the technical considerations and architectural decisions that helped define the COM-HPC electromechanical interface. He details key power management and signal integrity considerations that influenced pinout, pin counts, next-gen connector design and channel topologies.

In this video, Jens Hagemeyer and Martin Kaiser from Bielefeld University explain how the COM-HPC platform management portion of the standard was developed and the thinking that went into it. The second portion of the video discusses COM-HPC for non-x86 architectures including ARM, RISC-V, GPUs, and FPGAs.