April 22, 2019
The myOPALE modular concept is based on four key points, all inspired by open or de facto standards used in the embedded market (1). It eliminates the mechanical link between the CPU module and its I/O cards thanks to PCI Express Gen3-over- cable interconnection. It uses a standard half-height 5.25-inch casing.
Link to White Paper: https://www.picmg.org/wp-content/uploads/White-Paper-MyOPALE-for-AI-on-the-Edge20190417.pdf
