Monthly Archives: May 2021

congatec – a leading vendor of embedded and edge computing technology – presents a brand new COM-HPC™ starter set at embedded world 2021 DIGITAL. Optimized for modular system designs utilizing the latest high-speed interface technologies such as PCIe Gen4, USB 4.0 and up to ultra fast 2×25 GbE connectivity as well as integrated MIPI-CSI vision capabilities, the starter set is based on congatec’s PICMG COM-HPC Computer-on-Module conga-HPC/cTLU, which leverages 11th Gen Intel® Core™ processor technology (code name Tiger Lake). This new high-end embedded module generation targets system engineers working on the broadband connected edge devices that are emerging in industrial IoT. Target markets include medical, automation, transportation and autonomous mobility, as well as vision based inspection and video surveillance systems, to name just a few.

Keeping COMs cool – This video is a step by step guide on how to mount congatec cooling solutions on to COM Express Type 7, 6 and 2.

More about cooling solutions here: https://bit.ly/32aR55x

ADLINK nanoX-EL supports 6th generation Intel Atom x6000 processors (Elkhart Lake) combined with Intel UHD graphics at low power envelope and high speed interfaces. nanoX-EL modules support In-Band ECC DDR4 memory up to 16GB, TCC and 2.5GbE with optional TSN and are also available in rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require reliability at all times. https://www.adlinktech.com/Products/C…