Monthly Archives: January 2021

PICMG CTO Doug Sandy presents PICMG industrial IoT initiatives. The video was first presented at Embedded Tech Trends 2021.

COM-HPC™ is a new Computer-on-Module standard designed specifically for High-Performance Computing. It does not replace the COM Express standard, but extends the Computer-on-Module idea to very powerful client and server-class processors, providing an unmatched infrastructure of high-end interfaces.COM-HPC is governed by the PICMG industrial group where it has recently been created by an international workgroup consisting of COM manufacturers including Avnet Integrated, semiconductor companies and infrastructure providers.

ADLINK COM Express Type 6 compact size cExpress-AR module features AMD Ryzen™ Embedded V2000 Series SoC with high-performance integrated AMD Radeon™ graphics. The cExpress-AR is the first Type 6 module on the market to support an AMD Ryzen Embedded 8 CPU core embedded SoC, with up to 16 threads and an impressive turbo boost up to 4.2 GHz. Compared to earlier quad-core AMD Ryzen Embedded V1000 Series SoC, the additional cores combined with the AMD “Zen 2” cores result in 15% IPC uplift, and double the performance-per-watt efficiency.

ADLINK’s cExpress-AR provides standard support for up to 64GB DDR4 in two SO-DIMMs. ECC memory support is available on selected SKUs as well as configurable TDP (down to 10W), while still offering 6 to 8 cores and passive cooling, making the V2000 Series well suited for mission critical application in harsh environments.

For further information about cExpress-AR, please visit: https://www.adlinktech.com/Products/C…