Member Press Releases

congatec launches COM Express Compact module with brand new Intel® Core™ Ultra processors

Next-generation AI computing for the edge  Deggendorf, Germany, 20 December 2023 * * * congatec – a leading vendor of embedded and edge computing technology – is introducing its latest […]

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COMh-caRP and COMh-ccAS: Kontron advances industrial High-Performance Computing

New COM-HPC® Client modules based on 13th Gen Intel® Core™ mobile and desktop processors for demanding multi-core applications Ismaning, Germany, 2023 – Kontron, a leading global provider [...]

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Sealevel to Showcase Latest in COM & I/O Portfolio at Embedded World 2023

LIBERTY, SC, USA February 21, 2023 – Sealevel Systems, an industry-leading developer and manufacturer of industrial I/O and embedded computing solutions, will premier its newest solutions at [...]

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Accelerating Technology Innovation for Autonomous Driving

ADLINK: Bringing AI-enabled embedded and rugged computing to everyday devices Summary: ADLINK will demonstrate its complete autonomous driving solution at Embedded World 2023 Hall 3, booth 147 [...]

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