PICMG Announcements
COM-HPC & COM Express
PICMG COM-HPC Mini working group reaches key milestone in record time
ModBlox7
PICMG Committee to Develop New Modular Box PC Open Specification
CompactPCI Serial
MicroTCA
The evolution never ends: PICMG announces new MicroTCA specifications
Floor Presentations
Tuesday, March 14th
1:30 – 3:30 PM, Booth 3-159, Kontron Press roundtable
3:00 PM, HONG KONG Room, PICMG Press Conference
Wednesday, March 15th
12:00 PM, Exhibitor’s forum/Booth H2-501 Samtec & PICMG: Exhibitor’s Forum – PICMG COM-HPC – What’s New in 2023?
2:00 PM, Booth 1-500 ModBlox7 Panel discussion featuring EKF, Ci4Rail, Pheonix Contact and Eltec
2:30 PM, Booth 1-500 MicroTCA Panel discussion featuring powerBridge, N.A.T. and IoXos
3:00 PM, Booth 1-500 COM-HPC Panel discussion featuring congatec, Connect Tech, samtec
Thursday, March 16th
10:15 AM, Weka-VIP Stage, congatec COM-HPC interview
2:15 PM, Embedded World Conference, COM-HPC Server-on-Modules for Modular Edge Server Deployments
Member Exhibits
| Member | Booth # | Member | Booth # |
| Acromag | 1-115 | ADLINK Technology | 3-147 |
| Supermicro | 1-208 | Eurotech | 3-153 |
| Hartmann Electronic | 1-211 | HARTING | 3-156 |
| ARBOR Technology | 1-253 | Kontron | 3-159 |
| AAEON | 1-306 | ENGICAM | 3-225 |
| SECO | 1-310 | Portwell | 3-231 |
| AXIOMTEK Deutschland | 1-330 | congatec | 3-241 |
| Yamaichi Electronics | 1-341 | TQ-Systems | 3-257 |
| DATA MODUL | 1-368 | ADVANTECH | 3-339 |
| EKF Elektronik | 1-406 | IBASE | 3-351 |
| ept | 1-407 | Sealevel | 3-359 |
| Connect Tech | 1-430 | Ci4Rail | 3-544 |
| PHOENIX CONTACT | 1-434 | powerBridge | 3-544 |
| nVent Schroff | 1-441 | N.A.T. | 3-544 |
| iWave | 1-457 | IOxOS | 3-544 |
| Embedded Computing Design | 1-500 | Eltec | 3-544 |
| Avnet Embedded | 1-510 | Avalue Technology | 3-550 |
| Elma Electronic | 1-555 | POLYRACK TECH-GROUP | 3-554 |
| AMI | 2-200 | Hirose Electric | 3A-211 |
| esd electronics | 2-358 | Texas Instruments | 3A-215 |
| Trenz Electronic | 2-409 | Keysight Technologies | 4-208 |
| ASUS IoT | 2-410 | dSPACE | 4-327 |
| Knowledge Resources | 2-416 | Samtec | 4A-324 |
| DFI | 2-631 | Robert Bosch | 4A-334 |
Selection of Member Demos
Company Name |
Booth # |
Demo Description |
| ADLINK Technology, Inc. | 3-147 | Express-RLP [13th Gen Intel Core based] COM-HPC-cRLS [13 Gen Intel Core based] Express-VR7 [AMD V3000 based] |
| Avnet Embedded | 1-510 | Full range of COM Express and COM-HPC modules at Embedded World, including live demos using our modules in various environments. |
| congatec | 3-241 | Lots of COM-HPC modules and some COM Express |
| N.A.T. | 3-544 | MTCA-based canny edge detection with FPGA |
| Samtec | 4A-324 | COM-HPC connector sample boards for customers to “see” and “feel”. |
| Sealevel Systems, Inc. | 3-359 | 12009 Compact Type 6 evaluation carrier board and the HazPAC 10 Rugged Panel PC on display for demo purposes (COM Express-based systems). |
| SECO | 1-320 | SECO will show its portfolio of COM Express and COM-HPC boards based on a range of x86 processor technologies. |
Member Announcements
Avnet Embedded
ADLINK
congatec
congatec presents first COM-HPC mini modules at embedded world 2023 – congatec
Sealevel
Sealevel to Showcase Latest in COM & I/O Portfolio at Embedded World 2023
Kontron
COMh-caRP and COMh-ccAS: Kontron advances industrial High-Performance Computing
18933-1-intel-rpl-p-kontron-solution-brief-v4 (1)
EKF
EKF Elektronik announces CompactPCI processor boards with 11th Gen Intel Core and Xeon processors
EPT
Selection of Featured Products
| Company Name | Booth # | Featured Products |
| ADLINK Technology, Inc. | 3-147 | Express-RLP [13th Gen Intel Core based] COM-HPC-cRLS [13 Gen Intel Core based] Express-VR7 [AMD V3000 based] |
| epzt GmbH | 1-407 | ModBlox7 80 pin board-to-board connector plug ept p/n 405-51080-51 socket ept p/n 406-51080-51 |
| nVent SCHROFF | 1-441 | ATCA system with EMC shielding up to 40 GHz, MTCA.4 System, CPCI System for railway onboard applications |
| Avnet Embedded | 1-510 | MSC HCA-RLP – Avnet Embedded expands its COM-HPC® product portfolio for high-performance computing applications and presents the new MSC HCA-RLP module family. The powerful COM-HPC Client modules integrate a 13th Gen Intel® Core™ processor giving application designers a great variety of choices of power efficient and performant compute solutions. The powerful MSC C6C-RLP COM Express™ Type 6 module family in the Compact form factor integrating an 13th Gen Intel® Core™ processor. |
| SECO | 1-320 | CALLISTO: COM Express® 3.1 Type 6 Basic Module with 13th Gen Intel® Processors (Raptor Lake-P) EUPHORIA: COM Express® 3.1 Type 6 Compact Module with Intel® Atom® x6000E Series, Intel® Pentium® and Celeron® N and J Series Processors (formerly Elkhart Lake) |
| congatec | 3-241 | COM-HPC Mini Module (preview) |
Conference Presenters
Jessica Isquith is the President of the PICMG consortium of companies and organizations that collaboratively develop open standards for embedded computing applications. She has over twenty years of leadership experience in the Embedded Computing industry. Her roles have included President of Aurora Technologies and Vice President of Marketing at Carlo Gavazzi / SIE Computing Solutions. Jessica is the founder of TISOAA, which provides strategic marketing services to a wide array of emerging technology companies. She holds bachelor’s and master’s degrees in engineering from Tufts University.
Mathias Beer is currently employed at Ci4Rail, since September 2020, holding the title of Chief Product Officer. Previously, Mathias held the position of Director Global Technical Solutions, Director Global Marketing, while working at duagon Germany. Mathias held this role for 6 years (March 2015 – October 2020). Before this, Mathias held the position of Director Customer Relationship Management, while working at duagon Germany. Mathias occupied this position for 2 years (March 2013 – April 2015). Previously, Mathias held the position of Head of Product Management, while working at duagon Germany. Mathias held this role for 3 years (January 2010 – March 2013). Before this, Mathias held the position of Product Management, while working at duagon Germany. Mathias occupied this position for 24 months (January 2008 – January 2010). Previously, Mathias held the position of Project Management, while working at duagon Germany. Mathias held this role for 24 months (January 2006 – January 2008). Before this, Mathias held the position of IC Design, while working at duagon Germany. Mathias occupied this position for 4 years (December 2001 – January 2006).
ma**********@ci*****.com
Heiko Koerte is with N.A.T. since almost 26 years and responsible for the world wide sales and marketing activities of N.A.T.. Before having been appointed VP and Director Sales & Marketing back in 2000 he was leading the Software Development at N.A.T. for more than eight years. Due to his strong background in engineering he still is personally involved in the definition of all strategic hardware and software products at N.A.T.. He holds a diploma degree in Physics of Bonn University in Germany.
He**********@na*******.com
Christian Eder is co-founder and director product marketing at congatec. With 30 years of experience in embedded computing, he chairs the COM-HPC working group of PICMG. He is also active in a number of PICMG working groups and served as editor of the following specifications: COM Express 2.0, COM Express 2.1, COM Express Design Guide, Embedded EEPROM, Embedded EAPI, and COM Express 3.0. Christian is also a board member of SGET and editor of the SMARC 2.0 and 2.1 specification. He has a degree in electrical engineering from the University of Applied Sciences Regensburg, Germany.
Ch************@co******.com
