The Latest From PICMG
February 29, 2024
PICMG Announces Release of New InterEdge Standard for Open, Modular Process Control Systems
Highlights: Modular compute, switch, and I/O architecture enables interoperable standard for industrial PCs, PLCs, [...]
February 29, 2024
PICMG ModBlox7 Specification Standardizes Box PCs for Scalable, Interoperable Rugged Edge Computing
CPU, Power Supply, and I/O units can be configured as redundant or non-redundant systems in transportation, [...]
February 29, 2024
Decades of Contribution, Immeasurable Impact
This year PICMG celebrates thirty years of developing open computing specifications. And despite three decades of [...]
Latest Member News
December 20, 2023
congatec launches COM Express Compact module with brand new Intel® Core™ Ultra processors
Next-generation AI computing for the edge Deggendorf, Germany, 20 December 2023 * * * congatec – a leading vendor [...]
March 12, 2023
COMh-caRP and COMh-ccAS: Kontron advances industrial High-Performance Computing
New COM-HPC® Client modules based on 13th Gen Intel® Core™ mobile and desktop processors for demanding [...]
March 12, 2023
Sealevel to Showcase Latest in COM & I/O Portfolio at Embedded World 2023
LIBERTY, SC, USA February 21, 2023 – Sealevel Systems, an industry-leading developer and manufacturer of industrial [...]